Mabili a Sila a Taemane: Tataiso e Felletseng ea Likarolo, Tech, Melemo le Likopo
Mabili a sila a Diamond ke eng?
Mabili a sila a daemane ke lisebelisoa tse hlabang tse entsoeng ka likarolo tse tharo tsa mantlha:
- Diamond Abrasive Grain: Mokhoa oa ho itšeha, o entsoeng ka daemane ea tlhaho (e sa tloaelehang, e theko e phahameng) kapa taemane ea maiketsetso (e tloaelehileng haholoanyane, e entsoe ka mokhoa o tsitsitseng). Hangata lithollo tsa daemane tsa maiketsetso li koahetsoe (mohlala, ka nickel kapa titanium) ho ntlafatsa ho khomarela tlamo le ho hana ho apara.
- Bond Matrix: E tšoara lithollo tsa daemane sebakeng le ho laola hore na lijo-thollo li "senyeha" ka potlako hakae nakong ea ts'ebeliso. Mefuta e tloaelehileng ea bond e kenyelletsa resin, tšepe, vitrified, le electroplated (ho feta ka sena karolong ea Technical Info).
- Pore Structure: Likheo tse nyane pakeng tsa bond le lijo-thollo tse lumellang ho phalla ha pholiso, ho tlosoa ha chip, le ho thibela ho koala-ho bohlokoa bakeng sa ho boloka ho nepahala ha lisebelisoa tsa mocheso o phahameng.
Likarolo tsa Bohlokoa tsa Mabili a sila a Diamond
Mabili a sila a litaemane a hlalosoa ke likarolo tse etsang hore e be tse loketseng lisebelisoa tse thata. Mona ke tsa bohlokoa ka ho fetisisa tseo u ka li nahanang:
1. Ikhethang Hardness & Wear Resistance
Taemane e boemong ba 10 sekaleng sa boima ba Mohs (se phahameng ka ho fetisisa ho khoneha), ho bolelang hore e ka sila thepa ka thata ho fihla ho 9 Mohs-ho kenyeletsoa lirafshoa tsa alumina, silicon carbide, khalase le tungsten carbide. Ho fapana le mabili a aluminium oxide kapa silicon carbide (a senyehang kapele ka lisebelisoa tse thata), mabili a daemane a boloka sebopeho sa ona mme a sebetsa hantle bakeng sa 50-100x nako e telele, a fokotsa litšenyehelo tsa ho khutlisa lisebelisoa.
2. Bokhoni ba ho Sila ka nepo
Ka boholo ba lijo-thollo tse ntle joalo ka 0.5 μm (micrometers), mabili a daemane a fihlella holimo a boreleli joalo ka Ra 0.01 μm - e bohlokoa bakeng sa likarolo tsa optical, substrates ea semiconductor, le lisebelisoa tsa bongaka moo esita le mefokolo e nyane e bakang ho hloleha.
3. Mocheso Resistance & Cool Cutting
Diamond e na le conductivity ea mocheso ea 5x e phahameng ho feta koporo, e lumellang hore e qhale mocheso ka potlako nakong ea ho sila. Sena se fokotsa "tšenyo ea mocheso" (mohlala, mapetsong, ho chesoa, kapa ho phunya ha lintho) linthong tse baballang mocheso joalo ka likhalase, quartz, le lirafshoa tse tsoetseng pele.
4. Customizability
Baetsi ba lokisa mabili a daemane ho latela lits'ebetso tse ikhethileng ka ho fetola:
- Boholo ba lijo-thollo (mahoashe bakeng sa ho tlosa thepa ka potlako, hantle bakeng sa ho qeta).
- Mofuta oa bond (resin bakeng sa lits'ebetso tsa mocheso o tlase, tšepe bakeng sa ho sila ka boima bo boima).
- Sebopeho sa mabili (se bataletseng, kopi, sejana, kapa radius) ho ts'oana le geometry ea mosebetsi.
Tlhahisoleseding ea Theknoloji: Kamoo Mabili a sila a Diamond a sebetsang kateng
Ho khetha lebili le nepahetseng la daemane, ho bohlokoa ho utloisisa lintlha tsa eona tsa tekheniki. Ka tlase ke li-parameter tsa bohlokoa tsa tekheniki:
1. Mofuta oa Bond: "Mokokotlo" oa Wheel
Bond e etsa qeto ea ho tšoarella ha lebili, lebelo la ho itšeha, le ho tšoaneleha ha lisebelisoa tse fapaneng. Mona ke kamoo mefuta e mene ea mantlha ea bond e bapisoang:
| Mofuta oa Bond | Thepa ea Bohlokoa | Molemo ka ho fetisisa Bakeng sa |
|---|---|---|
| Resin Bond | E feto-fetoha, moloko o fokolang oa mocheso, ho itšeha ka potlako. E senya butle-butle ho pepesa lijo-thollo tse ncha tsa daemane. | Mesebetsi ea ho qetela (mohlala, likhalase tsa optical, li-wafers tsa semiconductor), lisebelisoa tse kotsing ea ho senyeha ha mocheso. |
| Metal Bond | Boima bo phahameng, ho hanyetsa ho apara, le ho tiea. E loketse bakeng sa ho tlosa thepa e boima. | Ho sila litšepe tse thata (tungsten carbide), konkreite le majoe. E hloka pholiso ho thibela mocheso o feteletseng. |
| Vitrified Bond | Ho hanyetsa mocheso o phahameng, ho boloka sebopeho se setle, le ho koala ho tlase. | Ho sila ka nepo ha lirafshoa, lithulusi tsa carbide, le tšepe e belehang. E sebelisoa mecheng ea ho sila ka lebelo le phahameng (HSG). |
| Electroplated Bond | Lera le lesesaane, le letenya le nang le lithollo tsa daemane tse pepeneneng. E fana ka bokhoni bo phahameng ba ho itšeha. | Ho sila ka profil (mohlala, li-blade tsa turbine, likoti tsa hlobo) le tlhahiso ea li-batch tse nyane. |
2. Mahlohonolo a Taemane
Concentration e bolela palo ya mabele a daemane lebiding (e lekantsweng e le carat per cubic centimeter). Likhakanyo tse tloaelehileng li tloha ho 50% ho isa ho 150%:
- 50–75%: Ho sila ka mosebetsi o bobebe (mohlala, khalase ea ho qetela).
- 100%: Ho sila ka kakaretso (mohlala, lisebelisoa tsa carbide).
- 125–150%: Ho sila ka mosebetsi o boima (mohlala, konkreite, lejoe).
Matla a phahameng = bophelo ba mabili a malelele empa litšenyehelo tse phahameng.
3. Boholo ba lijo-thollo
Boholo ba lijo-thollo bo ngotsoe ka nomoro ea letlooeng (mohlala, 80# = mahoashe, 1000# = fine) kapa boholo ba micrometer (μm). Molao oa letsoho:
- Mabele a mahoashe (80#–220#): Ho tlosa thepa ka potlako (mohlala, ho etsa liboloko tsa ceramic).
- Lithollo tse mahareng (320#–600#): Ho tlosa le ho qeta ho leka-lekana (mohlala, ho sila li-carbide tse kentsoeng).
- Mabele a matle (800#–2000#): Qetello e nepahetseng haholo (mohlala, lilense tsa optical, semiconductor wafers).
4. Lebelo la Lebili
Mabili a daemane a sebetsa ka lebelo le ikhethileng (le lekantsoeng ka limithara motsotsoana, m/s) ho ntlafatsa ts'ebetso:
- Resin bond: 20-35 m / s (lebelo le tlaase ho ea bohareng).
- Bond ea tšepe: 15-25 m / s (lebelo le mahareng, le hloka pholileng).
- Vitrified bond: 30–50 m/s (lebelo le phahameng, le loketse HSG).
Ho feta lebelo le khothaletsoang ho ka etsa hore lebili le phatlohe kapa lithollo tsa daemane li tsoe.
Melemo ea Mabili a Ho Sila Taemane Ho Feta Li-Abrasives tsa Setso
Mabili a khale a abrasive (mohlala, aluminium oxide, silicon carbide) a theko e tlase, empa a haelloa ke ts'ebetso ha o sila lisebelisoa tse thata kapa tse nepahetseng. Mona ke ka lebaka leo mabili a daemane a lokelang ho tseteloa:
1. Bophelo bo Bolelele ba Sesebelisoa
Joalokaha ho boletsoe pejana, mabili a daemane a nka nako e telele ho 50-100x ho feta mabili a aluminium oxide ha a sila lisebelisoa tse thata. Ka mohlala, lebili la daemane le ka sila li-carbide tse 10 000 pele li hloka ho nkeloa sebaka, ha lebili la aluminium oxide le ka tšoara 100 feela. Sena se fokotsa nako ea ho fokotsa lisebelisoa le ho fokotsa litšenyehelo tsa nako e telele.
2. Tšebeliso e Phahameng ea ho Sila
Ho thatafala ha taemane ho e lumella ho khaola lisebelisoa ka potlako ho feta li-abrasives tsa setso. Mohlala, ho sila poleiti ea aluminium e botenya ba 10mm ka lebili la daemane ho nka metsotso e 2-3, ha ho bapisoa le metsotso e 10-15 ka lebili la silicon carbide.
3. Superior Surface Quality
Hangata mabili a tloaelehileng a siea "li-scratches" kapa "micro-cracks" holim'a lisebelisoa tse thata, tse hlokang mehato e eketsehileng ea polishing. Mabili a daemane a hlahisa sephetho se kang seipone ka nako e le 'ngoe, ho felisa tlhokahalo ea ho sebetsa ka mor'a ho sila le ho boloka nako.
4. Thepa e Fokotseng ea Lisebelisuoa
Ho sila ka nepo ka mabili a daemane ho fokotsa "ho sila ho feta tekano" (ho tlosa lintho tse ngata ho feta kamoo ho hlokahalang). Sena se bohlokoa bakeng sa lisebelisoa tse turang tse kang liphaphatha tsa semiconductor (moo sephaphatha se le seng se ka bitsang $1,000+) kapa lirafshoa tsa boemo ba bongaka.
5. Ho feto-fetoha ha maemo
Ho fapana le mabili a setso (a lekanyelitsoeng ho tšepe kapa thepa e bonolo), mabili a daemane a sila mefuta e mengata ea li-substrates: khalase, quartz, ceramics, carbide, lejoe, konkreite, esita le lisebelisoa tsa maiketsetso tse kang carbon fiber reinforced polymer (CFRP).
Lisebelisoa: Moo Mabili a Sila a Diamond a Sebelisitsoeng
Mabili a sila a litaemane a bohlokoa ho liindasteri tse hlokang ho nepahala le ho tšoarella. Ka tlase ke maemo a bona a sebelisoang haholo:
1. Semiconductor & Electronics Indasteri
- Ho sila li-wafers tsa silicon (tse sebelisoang ho li-microchips) ho fihlela libaka tse bataletseng haholo (± 0.5 μm flatness).
- Shaping gallium arsenide (GaAs) le silicon carbide (SiC) substrates bakeng sa motlakase oa motlakase le lisebelisoa tsa 5G.
- Ho hloekisa li-chips tsa LED ho ntlafatsa tlhahiso ea leseli.
2. Sefofane le Likoloi
- Li-blades tsa turbine tse silang (tse entsoeng ka titanium kapa Inconel) ho ea ho mamello e thata (± 0.01 mm) bakeng sa katleho ea enjene.
- Ho etsa li-brake discs tsa ceramic (tse sebelisoang likoloing tse sebetsang hantle) bakeng sa ho hanyetsa mocheso le ho phela nako e telele.
- Ho qeta likotoana tsa lisebelisoa tsa carbide (tse sebelisoang mochining oa enjine ea sefofane) ho boloka mathōko a bohale.
3. Optical & Medical Industries
- Ho bentša lilense tsa optical (khalase kapa polasetiki) bakeng sa lik'hamera, libonela-hōle, le likhalase tsa mahlo ho fumana libaka tse se nang mongoaha.
- Ho sila li-implants tsa bongaka (mohlala, manonyeletso a noka a ceramic, likurufu tsa masapo a titanium) ho kopana le litekanyetso tsa biocompatibility le ho lekana hantle.
- Ho etsa li-quartz crucibles (tse sebelisoang ho etsa semiconductor) ho tšoara silicon e qhibilihisitsoeng.
4. Kaho & Tshebetso ea Lejoe
- Ho sila mekato ea konkreite ho etsa libaka tse boreleli, tse leka-lekaneng bakeng sa meaho ea khoebo.
- Ho etsa lejoe la tlhaho (mabole, granite) bakeng sa li-countertops, lithaele le liemahale.
- Lejoe le benyang (mohlala, quartzite) ho ntlafatsa boipiletso ba lona bo botle.
5. Tool & Die Manufacturing
- Ho chorisa limilili tsa ho qetela tsa carbide, li-drill le lisebelisoa tsa ho phunya ho khutlisetsa ts'ebetso ea ho itšeha.
- Ho sila li-cavities tsa hlobo (tse sebelisoang ho etsa ente ea polasetiki) ho etsa libopeho tse nepahetseng le ho qeta holimo.
Mokhoa oa ho khetha Wheel e nepahetseng ea ho sila taemane
Ho khetha lebili le nepahetseng ho itšetlehile ka lintlha tse tharo:
- Sesebediswa sa Mosebetsi: Khetha mofuta wa bonto o tsamaellanang le boima ba thepa (mohlala, bonto ya metale bakeng sa carbide, bonto ya resin bakeng sa kgalase).
- Sepheo sa ho sila: lijo-thollo tse mahoashe bakeng sa ho tlosa thepa, lijo-thollo tse ntle bakeng sa ho qeta.
- Tšebelisano ea Mochini: Netefatsa hore lebelo le boholo ba lebili li tsamaisana le litlhaloso tsa mochini oa hau oa ho sila.
Ka mohlala:
- Haeba u sila sephaphatha sa silicon (se bonolo, se sa utloeng mocheso), lebili la bond ea resin le 1000 # lijo-thollo le loketse.
- Haeba o etsa sesebelisoa sa tungsten carbide (e thata, e boima), lebili la tšepe le nang le 220 # lijo-thollo le sebetsa hantle.
Nako ea poso: Aug-31-2025