Diamond Profile Wheels: Tataiso e Feletseng ea Likarolo, Tech, Melemo le Likopo
Lefatšeng la ho sila le ho seha ka mokhoa o nepahetseng, mabili a profil ea taemane a hlahella e le sesebelisoa sa ho fetola papali—se etselitsoeng ho sebetsana le thepa e thata, e robehileng ka ho nepahala ho ke keng ha bapisoa. Ho fapana le mabili a tloaelehileng a abrasive, lisebelisoa tsena tse khethehileng li phahamisa ho thatafala ha daemane (thepa ea tlhaho e thata ka ho fetisisa e tsejoang) ho fana ka liphello tse tsitsitseng, e leng se etsang hore e be tsa bohlokoa haholo indastering ho tloha moeeng ho ea ho tsa elektroniki. Tataiso ena e hlalosa tsohle tseo o hlokang ho li tseba ka mabili a profil ea taemane: likarolo tsa ona tsa mantlha, lintlha tsa tekheniki, melemo e ikhethang, le lits'ebetso tsa lefats'e la nnete.
Mabili a Profile ea Diamond ke afe?
Mabili a profil ea daemane ke lisebelisoa tse hlabang tse nang le sebaka sa ho sebetsa se bōpehileng hantle ("profile") e kentsoeng ka grit ea daemane. Likaroloana tsa daemane-ebang ke tsa tlhaho kapa tsa maiketsetso-li tlamahane le tšepe, resin, kapa vitrified base, ho etsa sesebelisoa se ka silang, sebopeho, kapa ho qeta thepa e hanyetsanang le li-abrasives tse tloaelehileng (mohlala, khalase, ceramics, lejoe le tšepe e thata joaloka tungsten carbide).
"Profaele" ka lebitso la bona e bua ka sebopeho sa lebili se ikhethileng - li-profiles tse tloaelehileng li kenyelletsa V-grooves, radii, chamfers, kapa libopeho tse rarahaneng tsa moetlo. Moralo ona o lumella lebili ho etsa lipaterone tse rarahaneng ho li-workpieces, ho tlosa tlhoko ea ho qetela le ho boloka nako ea tlhahiso.
Likarolo tsa mantlha tsa Mabili a Profile ea Diamond
Mabili a profil ea daemane a hlalosoa ke likarolo tse 'ne tsa bohlokoa tse a khethollang ho lisebelisoa tse tloaelehileng tsa abrasive:
1. Diamond Grit: The Hardness Advantage
Sefate sa daemane ke pelo ea mabili ana. Ho fapana le aluminium oxide kapa silicon carbide (e sebelisoang ka mabili a setso), daemane e na le tekanyo ea boima ba Mohs ea 10 (e phahameng ka ho fetisisa e ka khonehang), e e nolofalletsang ho khaola thepa ka boima ba ho fihla ho 9 sekaleng sa Mohs (mohlala, safire, quartz, le lirafshoa tse tsoetseng pele).
- Grit Size: Ho tloha ho mahoashe (46-80 grit) bakeng sa ho tlosa thepa ka potlako ho isa ho e ntle (325-1200 grit) bakeng sa ho qetela ka mokhoa o nepahetseng. Mahoashe a mahoashe a loketse ho bōptjoa, ha grit e ntle e fana ka sebaka se boreleli, se bentšitsoeng.
- Mofuta oa Grit: Taemane ea maiketsetso (e tloaelehileng haholo) e fana ka boleng bo tsitsitseng le katleho ea litšenyehelo, ha taemane ea tlhaho e sebelisetsoa mesebetsi e nepahetseng haholo (mohlala, tlhahiso ea semiconductor).
2. Boitsebiso ba Bond: E Ikhethela Ts'ebetso ea Wheel
Bond e tšoara grit ea daemane sebakeng 'me e susumetsa ho tšoarella ha lebili, lebelo la ho khaola, le boleng ba ho qetela. Ho sebelisoa mefuta e meraro ea mantlha ea litlamo:
| Mofuta oa Bond | Litšobotsi Tsa Sehlooho | Molemo ka ho fetisisa Bakeng sa |
|---|---|---|
| Metal Bond (Boronse, Nickel) | Ho tšoarella ho phahameng, ho apara butle, ho babatsehang bakeng sa ho sila ho boima | Ho etsa litšepe tse thata (tungsten carbide), lejoe le khalase |
| Resin Bond (Epoxy, Phenolic) | Ho khaola ka potlako, qetello e boreleli, moloko o fokolang oa mocheso | Ho phetheloa ka nepo ha lirafshoa, li-semiconductors le likarolo tsa optical |
| Vitrified Bond (Glass-Ceramic) | Boima bo phahameng, ho hanyetsa lik'hemik'hale, ho loketse bakeng sa ho sila ka lebelo le phahameng | Likarolo tsa sepakapaka (li-alloys tsa titanium), likarolo tsa koloi le tšepe ea lisebelisoa |
3. Phatlalatso e Nepahetseng: Libopeho tsa Tloaelo bakeng sa Mesebetsi e Itseng
Ho fapana le mabili a tloaelehileng, mabili a profil ea taemane a entsoe ka li-geometri tse tloaelehileng ho lumellana le sebopeho se hlokahalang sa workpiece. Liprofaele tse tloaelehileng li kenyelletsa:
- V-grooves (bakeng sa ho seha li-tubes tsa khalase kapa li-insulators tsa ceramic)
- Radii (bakeng sa lisebelisoa tsa bongaka kapa lilense tsa koloi)
- Li-chamfers (bakeng sa ho senya likarolo tsa tšepe kapa ho qeta liphaephe tsa semiconductor)
- Liprofaele tse rarahaneng tsa 3D (bakeng sa mahare a turbine ea sefofane kapa li-implants tsa meno)
Ho nepahala hona ho felisa "ho nahana" tlhahisong, ho netefatsa hore mosebetsi o mong le o mong o kopana le mamello e thata (hangata e le tlase ho ± 0.001 mm).
4. Ho hanyetsa Mocheso: Ho Sireletsa Lisebelisoa le Mabili
Diamond's high thermal conductivity (makhetlo a mahlano a koporo) e thusa ho qhala mocheso nakong ea ho sila-ea bohlokoa bakeng sa ho thibela tšenyo ea mosebetsi (mohlala, ho phunyeha ha khalase kapa ho phunya ka tšepe). Ntle le moo, lisebelisoa tsa bond joalo ka resin kapa vitrified li etselitsoe ho hanela mocheso, ho lelefatsa nako ea bophelo ba lebili le ho boloka ts'ebetso e sebetsang hantle.
Litlhaloso tsa Tekheniki tse lokelang ho nahanoa
Ha u khetha lebili la profil ea daemane, ho utloisisa lintlha tsena tsa tekheniki ho netefatsa ts'ebetso e nepahetseng:
- Bophara ba Wheel: Ho tloha ho 50 mm (lisebelisoa tse nyenyane, tse tšoaroang ka letsoho) ho ea ho 600 mm (li grinder tsa indasteri). Li-diameter tse kholo li lumellana le tlhahiso ea molumo o phahameng, ha mabili a manyenyane a loketse mesebetsi e nepahetseng (mohlala, ho etsa mabenyane).
- Mamello ea Boemo: E lekanya hore na sebopeho sa lebili se lumellana hantle hakae le moralo o lakatsehang. Batla mamello ea ± 0.002 mm bakeng sa lisebelisoa tse nepahetseng (mohlala, lilense tsa optical) le ± 0.01 mm bakeng sa tšebeliso e akaretsang.
- Lebelo la ho Sila: Ka tloaelo 15–35 m/s (limithara ka motsotsoana). Mabili a kopantsoeng le resin a sebetsana le lebelo le phahameng (ho fihlela ho 35 m / s) bakeng sa ho qeta ka potlako, ha mabili a kopantsoeng le tšepe a sebetsa hantle ka lebelo le tlaase (15-25 m / s) bakeng sa ho sila ho boima.
- Porosity: Palo ea likheo lipakeng tsa grit particles. Porosity e phahameng (e tloaelehileng ho li-resin bonds) e fokotsa ho koala le mocheso, ha porosity e tlaase (metal bonds) e eketsa nako e telele bakeng sa thepa e thata.
Melemo ea Bohlokoa ea Mabili a Profile ea Diamond
Ha ho bapisoa le mabili a tloaelehileng a abrasive kapa lisebelisoa tse ling tse nepahetseng (mohlala, li-laser cutters), mabili a profil ea taemane a fana ka melemo e mehlano e ke keng ea qojoa:
1. Phapang e Phahameng ka ho Fetisisa le ho tsitsisa
Ho thatafala ha daemane le profiling ea tloaelo li netefatsa ho tlosoa ha thepa e tšoanang le ho mamellana ka thata. Mohlala, tlhahisong ea li-semiconductor, mabili a profil ea daemane a sila liphaephe tsa silicon ho botenya ba 50-100 μm (e mosesaane ho feta moriri oa motho) ka mefuta e sa tšoaneng ho pholletsa le lihlopha.
2. Nako e telele ea ho phela (Nako e Fokotsoeng)
grit ea daemane e roala ka karoloana ea sekhahla sa aluminium oxide kapa silicon carbide. Lebili le le leng la setšoantšo sa daemane le ka tšoarella nako e telele ka makhetlo a 50-100 ho feta lebili la setso, la fokotsa liphetoho tsa lisebelisoa le nako ea ho theoha meleng ea tlhahiso. Bakeng sa bahlahisi ba likoloi, sena se fetolela ho fokotsa litšenyehelo tsa tlhokomelo le tlhahiso e phahameng.
3. Lebelo la ho itšeha ka potlako
Bokhoni ba taemane ba ho kuta ka thepa e thata bo fokotsa nako ea tlhahiso kapele. Mohlala, ho sila lehare la turbine ea ceramic ka lebili la profil ea daemane ho nka nako e tlase ho 30-50% ho feta ho sebelisa lebili la aluminium oxide e nang le vitrified - e bohlokoa haholo bakeng sa liindasteri tse phahameng joalo ka sefofane.
4. Tšenyo e Fokotseng ea Mosebetsi
Mocheso oa lebili le mokhoa o nepahetseng oa ho hlahloba lebili li fokotsa likoli tse kang ho petsoha (ka khalase), ho petsoha (ka lirafshoa), kapa ho chesoa (ka litšepe). Sena se felisa tlhoko ea ho qetela (mohlala, ho roala lehlabathe kapa ho bentša), ho boloka nako le litšenyehelo tsa mosebetsi.
5. Ho Ikamahanya le Lintho Tse Ngata ho Feta Lintho
Ho fapana le lisebelisoa tse ikhethileng tse sebetsang feela nthong e le 'ngoe, mabili a profil ea daemane a sebetsana le mefuta e mengata ea li-substrates tse thata:
- Khalase (lifensetere, lilense tsa optical, li-skrini tsa smartphone)
- Ceramics (li-implants tsa meno, liboto tsa potoloho ea elektroniki, lisebelisoa tsa ho hlapela)
- Litšepe (lisebelisoa tsa tungsten carbide, likarolo tsa sefofane sa titanium, lisebelisoa tsa bongaka tsa tšepe e sa hloekang)
- Lejoe (li-countertops tsa granite, lithaele tsa 'mabole, liphaphatha tsa semiconductor)
Lisebelisoa tsa 'Nete tsa Lefatše tsa Mabili a Profile ea Diamond
Mabili a profil ea daemane a sebelisoa hoo e batlang e le indastering e 'ngoe le e' ngoe e hlokang ho etsoa ka mokhoa o nepahetseng oa thepa e thata. Mona ke maemo a sebelisoang haholo:
1. Electronics le Semiconductors
- Silicon Wafer Processing: Mabili a profil ea daemane a kopantsoeng le resin a sila le ho bentša liphaephe tsa silicon ho botenya bo bobebe haholo, ho netefatsa ts'ebetso e nepahetseng bakeng sa li-microchips.
- Li-Ceramic Circuit Boards: Mabili a kopantsoeng ka tšepe a khaola li-V-grooves ka har'a liboto tsa ceramic ho boloka mesaletsa e tsamaisang, e nolofalletsang lisebelisoa tsa elektroniki tse kopaneng (mohlala, li-smartphone, lilaptop).
2. Sefofane le Likoloi
- Li-Turbine Blades: Mabili a daemane a Vitrified-bond a theha liprofaele tsa 3D holim'a mahare a turbine a titanium kapa nickel-alloy turbine, ho netefatsa ts'ebetso ea aerodynamic le ho hanyetsa mocheso o phahameng.
- Lilense tsa Likoloi: Mabili a tlanngoeng ka resin a theha mathōko a chitja (radii) holim'a lebone la hlooho kapa lilense tsa taillight, a ntlafatsa phallo ea khanya le ho tšoarella nako e telele.
3. Bongaka le Meno
- Li-Implants tsa Meno: Li-implants tsa mabili a taemane a Fine-grit a bentša titanium sebakeng se boreleli, ho fokotsa kotsi ea tšoaetso le ho ntlafatsa ho lumellana ha lintho.
- Lisebelisoa tsa ho Buoa: Mabili a kopantsoeng ka tšepe a leotsa li-scalpel le li-drill tsa tungsten carbide, ho netefatsa ho nepahala ha mekhoa e metle.
4. Kaho le Boqapi ba Majoe
- Ho Seha Granite/Marble: Mabili a maholo a profil ea daemane a tlanngoeng ka tšepe a seha libopeho tse rarahaneng (mohlala, li-countertops tse kobehileng, mathōko a khabisitsoeng) ka lejoe la tlhaho, a fana ka qetello e bentšitsoeng ntle le ho petsoha.
- Ho Kenya Khalase: Mabili a daemane a V-groove a seha li-tubes tsa khalase bakeng sa lisebelisoa tsa lipeipi kapa likhalase tsa meralo, a etsa bonnete ba hore li hloekile, esita le likarolo tse lekanang hantle.
5. Mabenyane le Boenjiniere bo nepahetseng
- Ho Seha Majoe a Majoe: Sebōpeho sa mabili a daemane a tlhaho le mahakoe a bentšang (mohlala, safire, lirubi) ho matlafatsa bokhabane ba ona, kaha li-abrasives tsa maiketsetso li ke ke tsa tsamaisana hantle le taemane.
- Likarolo Tsa ho Shebella: Mabili a manyane a tlanngoeng le resin a sila likere tse nyane le liliba tsa lioache tsa mabothobotho, a boloka mamello ea ± 0.0005 mm.
Mokhoa oa ho khetha Wheel e nepahetseng ea Diamond Profile
Ho khetha koloi e ntle ka ho fetisisa bakeng sa litlhoko tsa hau, latela mehato ena:
- Tseba Sesebediswa sa Mosebetsi: Khetha mofuta wa bonto o itshetlehileng hodima thatafalo (mohlala, bonto ya tshepe bakeng sa lejwe, resin bakeng sa dikeramiki).
- Hlalosa Boemo bo Hlokehang: Hlalosa sebopeho (V-groove, radius, joalo-joalo) le mamello (± 0.001 mm bakeng sa mesebetsi e nepahetseng).
- Bapisa Wheel le Grinder ea Hao: Netefatsa hore bophara ba lebili le lebelo la lebelo le tsamaellana le lisebelisoa tsa hau (sheba lebelo le phahameng la grinder).
- Nahana ka Bophahamo ba Tlhahiso: Bakeng sa mesebetsi e phahameng haholo, khetha tšepe e tšoarellang kapa li-bond tse nang le vitrified; bakeng sa ho nepahala ha li-batch tse nyane, khetha li-bond tsa resin.
Nako ea poso: Sep-07-2025